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Isabella V. — Mid-Level Program Management Engineer from Philippines

Isabella V.

Mid-Level Program Management Engineer

Philippines 3-6 years
Open to offersNew to Platform
Languages
EnglishTagalog
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About

Isabella V. is a seasoned Manufacturing Process Engineer with extensive experience in the semiconductor industry. Operating from Baguio City, Philippines, she currently excels as a Program Management Engineer at Texas Instruments. Over the past five years, Isabella has adeptly driven new product introductions and production ramp-ups, notably enhancing the manufacturing capacity by 3.5 million units, contributing to an estimated $22.5 million in annual revenue. Her career at Texas Instruments includes significant roles such as Ramp Program Management Engineer, where she led nfBGA New Product Introduction programs, and Mold Process Engineer, where she reduced defects through Failure Mode and Effects Analysis (FMEA) and championed key initiatives like Wire Shorts. Isabella's education culminated with a Bachelor of Science in Electronics Engineering from Saint Louis University. She is recognized for her proficiency in 4M Analysis, Statistical Process Control (SPC), and 8D Generation, among other skills, and holds certifications including Six Sigma Green Belt and Program Management Foundations.

Experience

  • Ramp Program Management Engineer

    Texas Instruments, Phil. · 2025 — Present
    Leads nfBGA New Product Introduction (NPI) programs from qualification to manufacturing ramp and production release. Evaluates BGA product offloads, ensuring manufacturing readiness and integration into TIPI production. Manages FCLGA Special Work Request builds for WCSP die qualification and supports cross-package development. Collaborates with various teams, including design and quality, to facilitate successful production introductions. Directs qualification activities related to production changes to maintain compliance with manufacturing and quality standards.
  • Mold Process Engineer

    Texas Instruments, Phil. · 2022 — 2025
    Conducted Failure Mode and Effects Analysis (FMEA) to reduce defects and enhance process reliability. Initiated Wire Shorts projects in the End-of-Line area, focusing on Commit-to-Zero initiatives to enhance product quality. Managed hold lot disposition processes to minimize inventory and improve accountability in the EOL area. Supervised qualification and validation of new TOWA molding machines to align with manufacturing standards. Improved die cleaning processes by qualifying new materials and implementing efficient cleaning methods, optimizing operational efficiency.
  • ATSS Coordinator

    Texas Instruments, Phil. · 2022 — 2022
    Developed and managed ATSS Work Queues for engineering change requests, ensuring documentation accuracy and timely approvals. Maintained data integrity and compliance within ATSS by overseeing engineering change documentation completeness. Monitored request statuses during the approval process, collaborating with cross-functional teams to meet 10-day approval cycles. Provided training for new hires on ATSS processes and system requirements.
  • Wirebond Ramp Process Engineer

    Texas Instruments, Phil. · 2020 — 2022
    Oversaw SWRs, generated bond programs, and conducted design of experiments to define parameters for NPIs during manufacturing ramp-up. Qualified additional wire bonders for automotive devices, increasing production capacity. Guided the transition of uBGA devices to nfBGA packages to facilitate product migration. Assisted in converting standard nfBGA substrates to superwide substrates to enhance manufacturing capability.
  • Internship- Prebond Process Engineer

    Texas Instruments, Phil. · 2019 — 2019
    Supported the qualification process for converting 1-Pass cut methods to Step-cut methods for legacy silicon die technologies, which improved die chipping performance.

Skills & Expertise

Education

  • Bachelor of Science in Electronics Engineering
    Saint Louis University · 2015 — 2020

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